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CVE-2016-2063
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the…
High7.8EPSS 0.46%
- Published
- Updated
- Reserved
- Assigned by
- mitre
Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Scores
| Scored by | CVSS | Score | Vector |
|---|---|---|---|
| NVDNVD · Modified | 3.1 | High7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
- EPSS (exploitation in 30 days)
- 0.46% · top 60% of all CVEs (3 Nov 2026)
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The list uses the assigner's score when there is one, then CISA's, then NVD's: High 7.8.
Weakness
Affected products
n/a
- affected n/a
References (3)
- 92381 (opens in a new tab)vdb-entryx_refsource_BIDx_transferred
- https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4 (opens in a new tab)x_refsource_CONFIRMx_transferred
- https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063 (opens in a new tab)x_refsource_CONFIRMx_transferred
Sources
The same CVE in the primary databases and aggregators, to check against.
- CVE.org record (opens in a new tab)
- CVE List JSON (GitHub) (opens in a new tab)
- NVD (opens in a new tab)
- FIRST EPSS (opens in a new tab)
- OSV.dev (opens in a new tab)
- GitHub Advisories (opens in a new tab)
- CIRCL Vulnerability-Lookup (opens in a new tab)
Badge for a README or a ticket
[](https://trackcve.app/cve/CVE-2016-2063)Record last updated .