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CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607,…
High7.8EPSS 0.24%
- Published
- Updated
- Reserved
- Assigned by
- qualcomm
Description
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Scores
| Scored by | CVSS | Score | Vector |
|---|---|---|---|
| NVDNVD · Modified | 3.0 | High7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
- EPSS (exploitation in 30 days)
- 0.24% · top 84% of all CVEs (4 Nov 2026)
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The list uses the assigner's score when there is one, then CISA's, then NVD's: High 7.8.
Weakness
- CWE416: Use After Free
- CWE-416 (opens in a new tab)All about CWE-416 and its CVEs
Affected products
Qualcomm Technologies, Inc. · Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
- affected MDM9206
- affected MDM9607
- affected MDM9650
- affected MSM8909W
- affected MSM8996AU
- affected SD 210/SD 212/SD 205
- affected SD 425
- affected SD 450
- affected SD 615/16/SD 415
- affected SD 625
- affected SD 650/52
- affected SD 820
- affected SD 820A
- affected SD 835
- affected SD 845
- affected SDX20
References (1)
- https://www.qualcomm.com/company/product-security/bulletins (opens in a new tab)x_refsource_CONFIRMx_transferred
Sources
The same CVE in the primary databases and aggregators, to check against.
- CVE.org record (opens in a new tab)
- CVE List JSON (GitHub) (opens in a new tab)
- NVD (opens in a new tab)
- FIRST EPSS (opens in a new tab)
- OSV.dev (opens in a new tab)
- GitHub Advisories (opens in a new tab)
- CIRCL Vulnerability-Lookup (opens in a new tab)
Badge for a README or a ticket
[](https://trackcve.app/cve/CVE-2017-18157)Record last updated .