CVE-2019-10484
Use after free issue occurs when command destructors access dynamically allocated response buffer which is already deallocated during…
- Published
- Updated
- Reserved
- Assigned by
- qualcomm
Description
Use after free issue occurs when command destructors access dynamically allocated response buffer which is already deallocated during previous command teardwon sequence in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8098, MSM8909W, Nicobar, QCS405, QCS605, SDA845, SDM660, SDM670, SDM710, SDM845, SDX24, SM6150, SM7150, SM8150, SM8250, SXR2130
Scores
| Scored by | CVSS | Score | Vector |
|---|---|---|---|
| NVDNVD · Modified | 3.1 | Medium5.5 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:N/A:H |
- EPSS (exploitation in 30 days)
- 0.17% · top 94% of all CVEs (5 Nov 2026)
The list uses the assigner's score when there is one, then CISA's, then NVD's: Medium 5.5.
Weakness
- Use After Free issue in Secure Processor NVM handler
- CWE-416 (opens in a new tab)All about CWE-416 and its CVEs
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
- affected APQ8098, MSM8909W, Nicobar, QCS405, QCS605, SDA845, SDM660, SDM670, SDM710, SDM845, SDX24, SM6150, SM7150, SM8150, SM8250, SXR2130
References (1)
- https://www.qualcomm.com/company/product-security/bulletins/november-2019-bulletin (opens in a new tab)x_refsource_CONFIRMx_transferred
Sources
The same CVE in the primary databases and aggregators, to check against.
- CVE.org record (opens in a new tab)
- CVE List JSON (GitHub) (opens in a new tab)
- NVD (opens in a new tab)
- FIRST EPSS (opens in a new tab)
- OSV.dev (opens in a new tab)
- GitHub Advisories (opens in a new tab)
- CIRCL Vulnerability-Lookup (opens in a new tab)
Badge for a README or a ticket
[](https://trackcve.app/cve/CVE-2019-10484)Record last updated .