Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon…

Description

Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150

Scores

EPSS (exploitation in 30 days)

0.19% · top 91% of all CVEs (6 Nov 2026)

The list uses the assigner's score when there is one, then CISA's, then NVD's: High 7.8.

Weakness

• Use After Free Issue in Camera
• CWE-415 (opens in a new tab)All about CWE-415 and its CVEs

Affected products

• Qualcomm, Inc. · Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

  • affected APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150

References (1)

• https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin (opens in a new tab)x_refsource_CONFIRMx_transferred

Sources

The same CVE in the primary databases and aggregators, to check against.

• CVE.org record (opens in a new tab)
• CVE List JSON (GitHub) (opens in a new tab)
• NVD (opens in a new tab)
• FIRST EPSS (opens in a new tab)
• OSV.dev (opens in a new tab)
• GitHub Advisories (opens in a new tab)
• CIRCL Vulnerability-Lookup (opens in a new tab)

Badge for a README or a ticket

[![CVE-2019-2266](https://trackcve.app/badge/CVE-2019-2266.svg)](https://trackcve.app/cve/CVE-2019-2266)

Record last updated 4 Aug 2024, 18:42 UTC.