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CVE-2020-11208
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in…
High7.8EPSS 1.7%
- Published
- Updated
- Reserved
- Assigned by
- qualcomm
Description
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
Scores
| Scored by | CVSS | Score | Vector |
|---|---|---|---|
| NVDNVD · Modified | 3.1 | High7.8 | CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
- EPSS (exploitation in 30 days)
- 1.7% · top 22% of all CVEs (6 Nov 2026)
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The list uses the assigner's score when there is one, then CISA's, then NVD's: High 7.8.
Weakness
- Buffer Overflow in DSP Process
- CWE-191 (opens in a new tab)All about CWE-191 and its CVEs
Affected products
Qualcomm, Inc. · Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile
- affected SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
References (3)
- https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin (opens in a new tab)x_refsource_CONFIRMx_transferred
- https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/ (opens in a new tab)x_refsource_MISCx_transferred
- https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/ (opens in a new tab)x_refsource_MISCx_transferred
Sources
The same CVE in the primary databases and aggregators, to check against.
- CVE.org record (opens in a new tab)
- CVE List JSON (GitHub) (opens in a new tab)
- NVD (opens in a new tab)
- FIRST EPSS (opens in a new tab)
- OSV.dev (opens in a new tab)
- GitHub Advisories (opens in a new tab)
- CIRCL Vulnerability-Lookup (opens in a new tab)
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[](https://trackcve.app/cve/CVE-2020-11208)Record last updated .